Prof. Hiroshi NishikawaJapan
The University of Osaka
| 2018/04 to present | | Professor at Joining and Welding Research Institute, The University of Osaka |
| 2006 - 2018 | | Associate Professor at Joining and Welding Research Institute, Osaka University |
| 2005 - 2006 | | Assistant Professor at Joining and Welding Research Institute, Osaka University |
| 2002 - 2005 | | Assistant Professor at Center for Advanced Science and Innovation, Osaka University |
lead-free solder, electronics packaging, mechanical properties, reliability
Recent Trend of Low-Temperature Solder for Electronics Packaging
TBA TBA
Lead-Free Soldering and Interconnect/TBA
Over the past few decades, owing to the implementation of the RoHS directive in EU and the increased environmental consciousness of consumers in the world, lead-free solder alloys have been widely used for electric interconnections. Nowadays, low-temperature soldering (LTS) has emerged as a vital process in the electronics industry, driven by the demand for energy-efficient processes, the increasing use of temperature-sensitive components, and the push for environmentally friendly materials. Especially, eutectic Sn-58Bi alloy has drawn much attention as a potential lead-free solder in the industry due to its melting temperature of 139 °C. In order to improve the mechanical properties of Sn-Bi alloys for low-temperature applications, designing the appropriate alloying elements and composition is essential.
In our group, we have investigated the possibility of hypoeutectic Sn-Bi alloys for low-temperature soldering. This invited talk will explore the recent trend in low-temperature solder, with a focus on their material characteristics and mechanical properties.