Prof. Jun MizunoJapan
National Cheng Kung University
| 2026/04～ to present | | Kumamoto University/Visiting Professor |
| 2026/03～ to present | | Japan Center, Chung-Hua Institution for Economic Research/Project Advisor |
| 2022/08～ to present | | NCKU/Academy of Innovative Semiconductor and Sustainable Manufacturing/ Professor |
| 2025/03 - 2026/02 | | Industry–Academia Collaboration with Yamakuchi University |
| 2025/10/21 - 2025/10/24 | | IMPAC 2025/ Manufacturing Processes in Advanced Packaging |
| 2015/04 - 2022/08 | | Professor, Research Organization for Nano Science and Engineering, Waseda University, Japan |
| 2005/04 - 2015/03 | | Associate Professor, Research Organization for Nano Science and Engineering, Waseda University, Japan |
| 2002/07 - 2005/03 | | Assistant Professor, Institute of Nano Science and Technology, Waseda University, Japan |
| 1990/04 - 2002/06 | | Manager of Engineering, Bosch, Germany |
| 1984/04 - 1990/03 | | Chief Engineer, Candela Laser, USA |
TSV (Through-Silicon Via), Microchannel and Vapor Chamber for Thermal Management, Hybrid Bonding, Advanced Interconnection Technologies Using Fluxless Bonding, AiP (Antenna in Package), RDL (Redistribution Layer), Interposer-Embedded GaN HEMT, PLP (Panel-Level Packaging, including TGV), IVR (Integrated Voltage Regulator), 3D X-ray CT Scanning for Non-Destructive Evaluation, Wafer Cleaning Technology Using Mist Hydrogen Water...
Received a Ph.D. in Applied Physics from Tohoku University. Currently a Professor at the Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University (NCKU). His research focuses on Advanced Heterogeneous Integration, including TSV, hybrid bonding, advanced interconnection technologies, thermal management, panel-level packaging, and non-destructive evaluation. He actively collaborates with industry and research institutions in Taiwan and Japan.