Mr. Takahashi YoshikiJapan
AGC Inc.
| 2021 to present | | Leader of Technology Planning Group, Technology Development General Division, Electronics Company, AGC Inc. |
| 2023 to present | | Director of Semiconductor Packaging Materials Business Development Department, Development Office, Electronic Materials General Division, Electronics Company, AGC Inc. |
| 2024 to present | | Deputy General Manager, Advanced Semiconductor Packaging Group, Electronics Company, AGC Inc. |
| 2012 - 2026 | | Full Member of Package Research Center at Georgia Institute of Technology |
| 2015 - 2017 | | Full Member of A*STAR IME FOPLP Consortium |
| 2018 - 2021 | | General Member of IOWN Global Forum |
Yoshiki Takahashi has 28 years of experience at AGC Inc., leading new business development in semiconductor packaging, Si-Ph, 5G/Beyond 5G, and display technologies. He has held strategic roles in AGC Electronics and Corporate, driving innovation across technical, planning, and marketing domains.