Prof. Ming-Hsien LiTaiwan
Department of Materials and Optoelectronic Science, National Sun Yat-sen University
| 2026/2 to present | | Assistant Professor |
| 2005 - 2011 | | PhD, Institute of Electrooptical Science and Engineering, National Cheng Kung University |
| 2025/2 - 2026/1 | | Associate Professor, Department of Electro-Optical Engineering, National Formosa University |
| 2024/8 - 2025/1 | | Associate Professor, Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University |
| 2020/2 - 2024/7 | | Assistant Professor, Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University |
Halide Perovskite, Nanomaterials, Solar Cells, Photodetectors, Gas Sensor
Nanoimprinted Submicron Honeycomb-Porous Electrodes for Back-Contact Perovskite Solar Cells
TBA TBA
Solar Cells/TBA
Perovskite solar cells (PSCs) have gained significant prominence due to their high power conversion efficiency (PCE) and low-cost fabrication. However, conventional sandwich-type architectures suffer from parasitic optical losses as incident light must traverse the substrate, transparent conductive oxides (TCO), and charge transport layers. Back-contact perovskite solar cells (BC-PSCs) mitigate these losses by positioning all electrodes beneath the absorber, allowing for direct illumination. Despite this structural advantage, the PCE of BC-PSCs remains limited because typical electrode linewidths and spacings—often in the micrometer (μm) range—far exceed the carrier diffusion lengths of perovskites, leading to severe recombination. In this work, we employ nanoimprint lithography (NIL) combined with plasma etching to fabricate submicron-scale honeycomb quasi-porous electrodes (HQPEs) for BC-PSCs. This top-down patterning strategy yields highly uniform and reproducible BC-electrodes while effectively mitigating lift-off failures and preserving structural integrity. Furthermore, by optimizing the perovskite deposition process onto these BC-electrodes, a flat, compact, and pinhole-free active layer was successfully achieved, ensuring high-quality interfacial contact.